Adhesive Bonding of InP ∕ InGaAsP Dies to Processed Silicon-On-Insulator Wafers using DVS-bis-Benzocyclobutene

By Gunther Roelkens, J. Brouckaert, Van D Thourhout, R. Baets, R. Nötzel, M. Smit. 2006

155 citations recorded by the source corpus.

Subfields: Biomedical Engineering, Electrical and Electronic Engineering

View Paper: https://www.semanticscholar.org/paper/fd951db4668e027874b456c0665eea53d479e6ce

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In Electrical and Electronic Engineering

1. C. Doerr

Citations in the corpus

• Silicon photonic integration in telecommunications (2015, background): “The next column is waferto-wafer assembly, including oxide bonding [27] and organic bonding [28] of III–V gain regions.”