An introduction to InP-based generic integration technology

By M. Smit, X. Leijtens, H. Ambrosius, E. Bente, J. V. D. van der Tol, B. Smalbrugge, Tjibbe de Vries, E. Geluk, J. Bolk, Rene P. J. van Veldhoven and 44 more. 2014

630 citations recorded by the source corpus.

Photonic integrated circuits (PICs) are considered as the way to make photonic systems or subsystems cheap and ubiquitous. PICs still are several orders of magnitude more expensive than their microelectronic counterparts, which has restricted their application to a few niche markets. Recently, a novel approach in photonic integration is emerging which will reduce the R&D and prototyping costs and the throughput time of PICs by more than an order of magnitude. It will bring the application of PICs that integrate complex and advanced photonic functionality on a single chip within reach for a large number of small and larger companies and initiate a breakthrough in the application of Photonic ICs. The paper explains the concept of generic photonic integration technology using the technology developed by the COBRA research institute of TU Eindhoven as an example, and it describes the current status and prospects of generic InP-based integration technology.

Subfields: Electrical and Electronic Engineering

View Paper: https://www.semanticscholar.org/paper/40c90ac5dd9a8b8af011551eb1cb9643f1466027

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In Electrical and Electronic Engineering

Citations in the corpus

Silicon Nitride in Silicon Photonics (2018, methodology): “The widely used group III–V photonics material indium phosphide (InP) is a foundry scale process that provides waveguides with optical gain and efficient signal modulation in the telecommunications wavebands [10].”
A monolithic integrated photonic microwave filter (2016, methodology): “ auxiliary waveguide (called Output) to another spot- size converter on the same facet. The chip was manufactured and packaged using an InP generic integration technology on a multi-project wafer run [40] (see Fabrication and packaging in the Methods section for more details). Figures 1c-1e show a 3”
Chip-based quantum key distribution (2015, methodology): “Fibre-to-the-home, data centre, and 100 Gbs − 1 metro and long-haul network applications have driven the development of the InP platform to the point of full integration of laser sources, ampli-ﬁers, modulators and detectors [10].”
Large-scale quantum photonic circuits in silicon (2016, background): “Recent theoretical work has considered the problem of characterizing such systems using single- and two-photon interference [48, 56, 71, 72].”
Survey and Evaluation of Space Division Multiplexing: From Technologies to Optical Networks (2015, background): “PICs have been demonstrated using monolithic integration [100], [101] and hybrid integration [102].”
Highly integrated optical phased arrays: photonic integrated circuits for optical beam shaping and beam steering (2017, background): “These are silicon photonic [4, 5], indium phosphide [6], and silica or silicon nitride platforms [7].”