W. Dow
Electrical and Electronic Engineering · with Huang · 2000–2009
A researcher in the Science corpus: 5 papers; trusts 2 researchers and is trusted by 0 researchers here, as inferred from the citation graph.
Subfields
- Electrical and Electronic Engineering — 38 citations into it
- Materials Chemistry — 35 citations into it
Whom W. Dow trusts overall
Their strongest outbound trust, strongest first, inferred from their citations.
Papers from W. Dow's perspective
Ordered by how strongly the researchers W. Dow trusts endorse each paper. Same corpus, a different order for every researcher.
- Phase-Field Models for Microstructure Evolution
- Phase field modeling of defects and deformation
- What is spinodal decomposition
- Phase-Field Simulation of Solidification
- Phase-field models in materials science
- A Superfilling Model that Predicts Bump Formation
- Correlation of stress and texture evolution during self- and thermal annealing of electroplated Cu films (Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407))
- Reduced electromigration of Cu wires by surface coating
- Alteration of Cu conductivity in the size effect regime
- Design of multiphysics actuators using topology optimization - Part I: One-material structures
Their papers
- Microvia filling by copper electroplating using diazine black as a leveler (2009) — 143 citations
- Influence of Molecular Weight of Polyethylene Glycol on Microvia Filling by Copper Electroplating (2005) — 185 citations
- Roles of Chloride Ion in Microvia Filling by Copper Electrodeposition I. Studies Using SEM and Optical Microscope (2005) — 141 citations
- Influence of convection-dependent adsorption of additives on microvia filling by copper electroplating (2005) — 192 citations
- TPR and XRD studies of yttria-doped ceria/γ-alumina-supported copper oxide catalyst (2000) — 176 citations