Influence of Molecular Weight of Polyethylene Glycol on Microvia Filling by Copper Electroplating

By W. Dow, M. Yen, Wen Lin, S. Ho. 2005

185 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials

View Paper: https://www.semanticscholar.org/paper/65b16057c272156428c7a4e54ea9a876b961ba6a