Premratn Taephaisitphongse

2001

A researcher in the Science corpus: 2 papers; trusts 0 researchers and is trusted by 0 researchers here, as inferred from the citation graph.

Who trusts Premratn Taephaisitphongse overall

1. W. Dow

Papers from Premratn Taephaisitphongse's perspective

Ordered by how strongly the researchers Premratn Taephaisitphongse trusts endorse each paper. Same corpus, a different order for every researcher.

1. Electrochemical Methods: Fundamentals and Applications
2. Correlation of stress and texture evolution during self- and thermal annealing of electroplated Cu films (Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407))
3. Reduced electromigration of Cu wires by surface coating
4. Alteration of Cu conductivity in the size effect regime

Their papers

• Electrochemical and Fill Studies of a Multicomponent Additive Package for Copper Deposition (2001) — 162 citations
• Three-Additive Model of Superfilling of Copper (2001) — 169 citations