A Superfilling Model that Predicts Bump Formation

By A. West, Steven Mayer, J. Reid. 2001

226 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Materials Chemistry

View Paper: https://www.semanticscholar.org/paper/1b458d120eb0d4e06065fa4f4d941f89c5aefa1d

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1. H. Deligianni
2. R. Binstead
3. P. Vereecken
4. P. C. Andricacos

Citations in the corpus

• The chemistry of additives in damascene copper plating (2005, background): “As a result, a strong hysteresis is observed for current–voltage curves extended past the desorption potential [6, 12].”