Microvia filling by copper electroplating using diazine black as a leveler

By W. Dow, Chih-Chan Li, Yonghong Su, Shao-Ping Shen, Chen‐Chia Huang, C. Lee, Bob Hsu, S. Hsu. 2009

143 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Materials Chemistry

View Paper: https://www.semanticscholar.org/paper/317538a31f06b43f6951050b2b3e4b5bd23f0b13