Ultrathin (<4 nm) SiO2 and Si-O-N gate dielectric layers for silicon microelectronics: Understanding the processing, structure, and physical and electrical limits
By Mark L. Green, Evgeni P. Gusev, R. Degraeve, Eric L. Garfunkel. 2001
747 citations recorded by the source corpus.
Subfields: Electrical and Electronic Engineering
View Paper: https://www.semanticscholar.org/paper/e047cf6269a292d8e1fde10df659f5c56f165efe
How researchers see this paper
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In Electrical and Electronic Engineering
- Haldun Kufluoglu
- Dhanoop Varghese
- Souvik Mahapatra
- M. A. Alam
- A. E. Islam
- Evgeni P. Gusev
- Sufi Zafar
- Tibor Grasser
Citations in the corpus
- Threshold voltage instabilities in high-/spl kappa/ gate dielectric stacks (2005, background): “This increase in gate leakage current density with scaling is the main motivation for replacing the conventional SiO -based gate dielectrics with higher films [1], [2], [4], [7].”
- A comprehensive model for PMOS NBTI degradation: Recent progress (2007, neutral): “All rights reserved.”