Ageing and Failure Modes of IGBT Modules in High-Temperature Power Cycling

By V. Smet, F. Forest, J. Huselstein, F. Richardeau, Zoubir Khatir, S. Lefebvre, M. Berkani. IEEE transactions on industrial electronics (1982. Print), 2011

583 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering

View Paper: https://www.semanticscholar.org/paper/7b6c84e072651a0bf8dd0aa262ed9cf5d6b6530f

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In Electrical and Electronic Engineering

1. Frede Blaabjerg
2. Huai Wang
3. Marco Liserre
4. Ke Ma
5. Lea Dorn-Gomba
6. Ali Emadi
7. John Reimers
8. Jorge O. Estima

Citations in the corpus

• Automotive Traction Inverters: Current Status and Future Trends (2019, background): “In fact, high temperatures have been identified as the primary source of failure and overheating dramatically reduces the reliability and lifetime of power converters [38], [39].”
• New Approaches to Reliability Assessment: Using physics-of-failure for prediction and design in power electronics systems (2016, methodology): “Instead of using dc pulse currents, a more realistic current profile with pulsewidth modulation (PWM) switching is applied in [27] to test 600-V/200-A IGBT modules in automotive applications.”
• Junction Temperature Control for More Reliable Power Electronics (2018, background): “For frequent repetition of thermal cycles, the resulting expansions and contractions of the material lead to fatigue of solder joints [1], and thus, cause aging [6].”
• A New Algorithm for Real-Time Multiple Open-Circuit Fault Diagnosis in Voltage-Fed PWM Motor Drives by the Reference Current Errors (2013, background): “and considering that they are often exposed to high stresses [1].”