Improving Integrated Circuit Performance Through the Application of Hardness-by-Design Methodology
By R. Lacoe. IEEE Transactions on Nuclear Science, 2008
151 citations recorded by the source corpus.
Subfields: Electrical and Electronic Engineering
View Paper: https://www.semanticscholar.org/paper/21ad9a783a2bbcce5bcc10aa80fca0ce0a816f79
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In Electrical and Electronic Engineering
- D. Fleetwood
- Pascale Gouker
- Véronique Ferlet-Cavrois
- Lloyd W. Massengill
- Paul E. Dodd
- M. Shaneyfelt
- J. Schwank
- J. Felix
Citations in the corpus
- Evolution of Total Ionizing Dose Effects in MOS Devices With Moore’s Law Scaling (2018, background): “With progressive technology scaling, thicknesses of isolation oxides also have decreased [6], [7], [12], leading to a general”
- Radiation-Induced Short Channel (RISCE) and Narrow Channel (RINCE) Effects in 65 and 130 nm MOSFETs (2015, background): “However, HBD techniques were required to prevent the opening of large leakage current paths [5].”
- Single Event Transients in Digital CMOS—A Review (2013, background): “Specific hardening-by-design rules, such as frequent well contacts, dummy junctions, etc [60], can be used to reduce the parasitic bipolar amplification and the resulting transient current.”
- Current and Future Challenges in Radiation Effects on CMOS Electronics (2010, background): “example a gate region that is annular, completely surrounding the drain with the source in turn surrounding the gate [39].”