Mobility measurement and degradation mechanisms of MOSFETs made with ultrathin high-k dielectrics
By Wenjuan Zhu, Jin-Ping Han, T. Ma. IEEE Transactions on Electron Devices, 2004
241 citations recorded by the source corpus.
Subfields: Electrical and Electronic Engineering
View Paper: https://www.semanticscholar.org/paper/16f0911c82a9cbcedee06f6d2c91a089436a4af5
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In Electrical and Electronic Engineering
- Adrian M. Ionescu
- K. Boucart
- Peide D. Ye
- Yi Xuan
- Mamidala Jagadesh Kumar
- D. Abdi
- Sneh Saurabh
- Kaustav Banerjee
Citations in the corpus
- Length scaling of the Double Gate Tunnel FET with a high-K gate dielectric (2007, background): “The interfacial layer improves the surface properties (less traps [13], therefore higher Coulomb mobility [14]) and is often used to avoid mobility degradation in MOSFETs employing high-K materials.”
- Submicrometer Inversion-Type Enhancement-Mode InGaAs MOSFET With Atomic-Layer-Deposited $\hbox{Al}_{2}\hbox{O}_{3}$ as Gate Dielectric (2007, background): “split C–V due to the interface traps [24].”