C. Mark Johnson
IEEE transactions on device and materials reliability · 2005–2013
A researcher in the Science corpus: 2 papers; trusts 0 researchers and is trusted by 3 researchers here, as inferred from the citation graph.
Who trusts C. Mark Johnson overall
Papers from C. Mark Johnson's perspective
Ordered by how strongly the researchers C. Mark Johnson trusts endorse each paper. Same corpus, a different order for every researcher.
- Selected failure mechanisms of modern power modules (Microelectronics and reliability)
- Exploration of Power Device Reliability Using Compact Device Models and Fast Electrothermal Simulation (IEEE transactions on industry applications)
- A thermal model for insulated gate bipolar transistor module (IEEE transactions on power electronics)
- An assessment of wide bandgap semiconductors for power devices
- Predicting solder joint reliability for thermal, power, and bend cycle within 25% accuracy (2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220))
- Void induced thermal impedance in power semiconductor modules: some transient temperature effects (Conference Record of the 2001 IEEE Industry Applications Conference. 36th IAS Annual Meeting (Cat. No.01CH37248))
- Heterogeneous materials: a new class of materials with unprecedented mechanical properties (Heterostructured Materials)
- Mechanism-based Strain Gradient Plasticity 를 이용한 나노 인덴테이션의 해석
- Evading the strength–ductility trade-off dilemma in steel through gradient hierarchical nanotwins (Nature Communications)
- Nanocrystalline electrodeposited Ni: microstructure and tensile properties