Andreas C. Cangellaris
Materials Chemistry · 2003–2010
A researcher in the Science corpus: 3 papers; trusts 1 researcher and is trusted by 2 researchers here, as inferred from the citation graph.
Subfields
- Materials Chemistry — 6 citations into it
Whom Andreas C. Cangellaris trusts overall
Their strongest outbound trust, strongest first, inferred from their citations.
Who trusts Andreas C. Cangellaris overall
Papers from Andreas C. Cangellaris's perspective
Ordered by how strongly the researchers Andreas C. Cangellaris trusts endorse each paper. Same corpus, a different order for every researcher.
- Luttinger liquid theory as a model of the gigahertz electrical properties of carbon nanotubes
- Electrical Modeling and Characterization of Through Silicon via for Three-Dimensional ICs (IEEE Transactions on Electron Devices)
- Orthonormal Vector Fitting: A Robust Macromodeling Tool for Rational Approximation of Frequency Domain Responses (IEEE Transactions on Advanced Packaging)
- Single-Conductor Transmission-Line Model of Multiwall Carbon Nanotubes (IEEE transactions on nanotechnology)
- Modeling of irregular shaped power distribution planes using transmission matrix method
- On deembedding of port discontinuities in full-wave CAD models of multiport circuits (Intelligent Memory Systems)
- Stability, Causality, and Passivity in Electrical Interconnect Models (IEEE Transactions on Advanced Packaging)
- Carbon Nanomaterials for Next-Generation Interconnects and Passives: Physics, Status, and Prospects (IEEE Transactions on Electron Devices)
- 3D stacked IC demonstration using a through Silicon Via First approach (2008 IEEE International Electron Devices Meeting)
- Ballistic carbon nanotube field-effect transistors (Nature)
Their papers
- Multigrid Finite Element Methods for Electromagnetic Field Modeling (2006) — 207 citations
- On deembedding of port discontinuities in full-wave CAD models of multiport circuits (2003) — 47 citations
- Progress Review of Electromagnetic Compatibility Analysis Technologies for Packages, Printed Circuit Boards, and Novel Interconnects (2010) — 196 citations