Progress Review of Electromagnetic Compatibility Analysis Technologies for Packages, Printed Circuit Boards, and Novel Interconnects

By E. Li, Xing-Chang Wei, Andreas C. Cangellaris, En-Xiao Liu, Yaojiang Zhang, M. D'amore, Joungho Kim, Toshio Sudo. IEEE transactions on electromagnetic compatibility (Print), 2010

196 citations recorded by the source corpus.

Subfields: Aerospace Engineering, Electrical and Electronic Engineering

View Paper: https://www.semanticscholar.org/paper/5410cf75fa5783434cfe14eca6fe817eb6a07526