Carbon Nanomaterials for Next-Generation Interconnects and Passives: Physics, Status, and Prospects
By Hong Li, Chuan Xu, Navin Srivastava, Kaustav Banerjee. IEEE Transactions on Electron Devices, 2009
437 citations recorded by the source corpus.
Subfields: Materials Chemistry
View Paper: https://www.semanticscholar.org/paper/df64e36bedfb44d1d824cb16199c83d483debb95
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In Materials Chemistry
- Yaojiang Zhang
- Xing-Chang Wei
- Joungho Kim
- M. D'amore
- E. Li
- Andreas C. Cangellaris
- En-Xiao Liu
- Toshio Sudo
Citations in the corpus
- Progress Review of Electromagnetic Compatibility Analysis Technologies for Packages, Printed Circuit Boards, and Novel Interconnects (2010, methodology): “For vertical INCs, the MFP of both electrons and phonons is generally larger than the height; therefore, the ballistic electrical and thermal transport regime can be assumed [80].”