Breakdown Enhancement of AlGaN/GaN HEMTs on 4-in Silicon by Improving the GaN Quality on Thick Buffer Layers
By S. L. Selvaraj, T. Suzue, T. Egawa. IEEE Electron Device Letters, 2009
209 citations recorded by the source corpus.
Subfields: Condensed Matter Physics, Electronic, Optical and Magnetic Materials, Materials Chemistry
View Paper: https://www.semanticscholar.org/paper/aef912905f4a0c6d415f7f37a8e6290524496db0
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In Condensed Matter Physics
- Yuhao Zhang
- Tomás Palacios
- Zhihong Liu
- Min-Chul Sun
- Feng Gao
- Hyung-Seok Lee
- Daniel Piedra
- T. Fujishima
In Electronic, Optical and Magnetic Materials
In Materials Chemistry
Citations in the corpus
- Electrothermal Simulation and Thermal Performance Study of GaN Vertical and Lateral Power Transistors (2013, result): “This relationship and value of the slope are consistent with other reports [20], [21].”
- High Breakdown ($> \hbox{1500\ V}$) AlGaN/GaN HEMTs by Substrate-Transfer Technology (2010, background): “been reported to improve the device breakdown voltage beyond 800 V, including increasing the epitaxial-layer thickness [5]–”
- GaN Power Transistors on Si Substrates for Switching Applications (2010, result): “There were several other reports on Si substrates for power switching application [12], [ 13 ].”