Poly-Si-Gate-Related Variability in Decananometer MOSFETs With Conventional Architecture
By Andrew R. Brown, Gareth Roy, Asen Asenov. IEEE Transactions on Electron Devices, 2007
143 citations recorded by the source corpus.
Subfields: Electrical and Electronic Engineering
View Paper: https://www.semanticscholar.org/paper/52bde89ca68208c9cf62d9fde93248dd79820446
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In Electrical and Electronic Engineering
Citations in the corpus
- Process Technology Variation (2011, background): “strain [wafer-level biaxial [21], high-stress capping layers [22], and embedded silicon–germanium (SiGe) [23]], and variation associated with gate material granularity (poly gates [24] and”