Monitoring Solder Fatigue in a Power Module Using Case-Above-Ambient Temperature Rise

By D. Xiang, L. Ran, P. Tavner, A. Bryant, Shaoyong Yang, P. Mawby. IEEE transactions on industry applications, 2011

178 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering

View Paper: https://www.semanticscholar.org/paper/a9b7978c09bab7d596dcc57545dabb2dd5d1bc3a

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In Electrical and Electronic Engineering

1. Byeng Dong Youn
2. Guiyun Tian
3. Bongtae Han
4. Wenping Cao
5. Changwoon Han
6. Hyunseok Oh
7. P. McCluskey

Citations in the corpus

• Physics-of-Failure, Condition Monitoring, and Prognostics of Insulated Gate Bipolar Transistor Modules: A Review (2015, methodology): “CM technique based on thermal resistance estimation [65].”
• State Detection of Bond Wires in IGBT Modules Using Eddy Current Pulsed Thermography (2014, background): “It has been proven that the ageing of bond wires and solder fatigue are the most significant failure mechanisms in IGBT modules [2], [5], [11]–[14].”