Semiconductor Power Devices: Physics, Characteristics, Reliability
By J. Lutz, H. Schlangenotto, U. Scheuermann, R. D. Doncker. 2011
494 citations recorded by the source corpus.
View Paper: https://www.semanticscholar.org/paper/180f5cca35957c741a1c41f63f88668817ac5269
How researchers see this paper
The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.
- Srabanti Chowdhury
- Marko J. Tadjer
- J. Tsao
- Umesh K. Mishra
- Alex Q. Huang
- Masataka Higashiwaki
- Mike E. Coltrin
- Debdeep Jena
Citations in the corpus
- Ultrawide‐Bandgap Semiconductors: Research Opportunities and Challenges (2018, background): “2018, 4, 1600501 In general, for UWBG materials to have impact on these applications, vertical device structures[90,214,215] similar to those utilized today for Si and SiC will need to be developed.”
- A Comprehensive Study of Short-Circuit Ruggedness of Silicon Carbide Power MOSFETs (2016, unknown): “Using formulas and values reported in [24], [34], and [35], it is possible to carry out an approximate estimation of the leakage current as a function of temperature”
- Review of Silicon Carbide Power Devices and Their Applications (2017, background): “reverse bias are the three major criteria for evaluating reliability [43].”