Review of Silicon Carbide Power Devices and Their Applications
By X. She, Alex Q. Huang, Óscar Lucía, Burak Ozpineci. IEEE transactions on industrial electronics (1982. Print), 2017
1,303 citations recorded by the source corpus.
Subfields: Electrical and Electronic Engineering
View Paper: https://www.semanticscholar.org/paper/b4eede88fb2e4f2c864333b5bfd76d7d83c56792
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In Electrical and Electronic Engineering
- Tibor Grasser
- Thomas Aichinger
- Wolfgang Gustin
- Hans Reisinger
- Shuo Wang
- Lucian Mihet-Popa
- Aganti Mahesh
- Boyi Zhang
Citations in the corpus
- A Survey of EMI Research in Power Electronics Systems With Wide-Bandgap Semiconductor Devices (2020, background): “As a result, the output capacitance Cds of Si MOSFETs is also bigger than that of SiC MOSFETs.”
- A Review of SiC Power Module Packaging Technologies: Challenges, Advances, and Emerging Issues (2020, background): “manufacturing processes need to be improved to make the cost of SiC devices more justifiable [5], [11].”
- Inductive Wireless Power Transfer Charging for Electric Vehicles–A Review (2021, background): “switching losses, thermal stress and operates at high power levels [212].”
- Thermal management and packaging of wide and ultra-wide bandgap power devices: a review and perspective (2023, background): “SiC devices are now commercially available in the voltage class of 650–3300 V [7].”
- Review on SiC MOSFETs High-Voltage Device Reliability Focusing on Threshold Voltage Instability (2019, background): “reduction in system cost has the potential to compensate the higher cost of the SiC switch [6].”