Electrochemical and Fill Studies of a Multicomponent Additive Package for Copper Deposition

By Premratn Taephaisitphongse, Yang Cao, A. West. 2001

162 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Electrochemistry, Materials Chemistry

View Paper: https://www.semanticscholar.org/paper/21db0a8b528eb2bf73d50be43e79b3b48cc902cb