Three-Additive Model of Superfilling of Copper

By Yang Cao, Premratn Taephaisitphongse, R. Chalupa, A. West. 2001

169 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Electrochemistry, Materials Chemistry

View Paper: https://www.semanticscholar.org/paper/35e0ae08202724e68d1513d63ccb239e2fc0a920