Sheng Liu

Mechanical Engineering · Electronic Components and Technology Conference · 2007–2016

A researcher in the Science corpus: 5 papers; trusts 4 researchers and is trusted by 0 researchers here, as inferred from the citation graph.

Subfields

Whom Sheng Liu trusts overall

Their strongest outbound trust, strongest first, inferred from their citations.

  1. Zengyuan Guo
  2. Ravi S. Prasher
  3. J. D. Felske

Who trusts Sheng Liu overall

  1. Xiaobing Luo

Papers from Sheng Liu's perspective

Ordered by how strongly the researchers Sheng Liu trusts endorse each paper. Same corpus, a different order for every researcher.

  1. Entransy—A physical quantity describing heat transfer ability
  2. Thermal Resistance of Particle Laden Polymeric Thermal Interface Materials
  3. Analysis of high-power packages for phosphor-based white-light-emitting diodes
  4. Thermal Spreading Resistance of Eccentric Heat Sources on Rectangular Flux Channels (Heat Transfer)
  5. Carbon nanotube composites for thermal management
  6. The effect of thermal contact resistance on heat management in the electronic packaging
  7. Status and Future of High-Power Light-Emitting Diodes for Solid-State Lighting (Journal of Display Technology)
  8. Introduction to Solid-State Lighting
  9. Auger recombination rates in nitrides from first principles
  10. Least dissipation principle of heat transport potential capacity and its application in heat conduction optimization

Their papers