Thermal Resistance of Particle Laden Polymeric Thermal Interface Materials
By Ravi S. Prasher, J. Shipley, S. Prstic, P. Koning, Jinlin Wang. 2003
151 citations recorded by the source corpus.
Subfields: Materials Chemistry, Mechanics of Materials, Polymers and Plastics
View Paper: https://www.semanticscholar.org/paper/49716e5f51adc127784f868338b97d6d35aa8390
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In Materials Chemistry
In Mechanics of Materials
In Polymers and Plastics
Citations in the corpus
- Thermal Interface Materials: Historical Perspective, Status, and Future Directions (2006, methodology): “Fig. 8 shows the comparison of (9) (S-B model) with experimental data obtained on various PLT TIMs [ 25 ].”
- Effect of aggregation and interfacial thermal resistance on thermal conductivity of nanocomposites and colloidal nanofluids (2008, background): “face materials and high conductivity mold compounds in electronics cooling [12,13].”
- Heat and fluid flow in high-power LED packaging and applications (2016, methodology): “Many studies [128, 180-183] have found that, as shown in Fig.”