Heat and fluid flow in high-power LED packaging and applications

By Xiaobing Luo, Run Hu, Sheng Liu, Kai Wang. 2016

414 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Mechanical Engineering, Surfaces, Coatings and Films

View Paper: https://www.semanticscholar.org/paper/37b25c91648e799ea293c23ffbf1c61e07ea5bdb

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Mechanical Engineering

1. Motong Li
2. Zhibin Yu
3. Bing-yang Cao

Citations in the corpus

• A comprehensive review on microchannel heat sinks for electronics cooling (2023, background): “This can produce turbulence contributing to the heat transfer [103].”