Thermal analysis and optimization of multiple LED packaging based on a general analytical solution

By Ting Cheng, Xiaobing Luo, Suyi Huang, Sheng Liu. Electronic Components and Technology Conference, 2009

157 citations recorded by the source corpus.

Subfields: Civil and Structural Engineering, Condensed Matter Physics, Electrical and Electronic Engineering

View Paper: https://www.semanticscholar.org/paper/178f6d04681460261e624ed7e0fb6b46536d406b

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Condensed Matter Physics

1. Xiaobing Luo
2. Sheng Liu
3. Kai Wang
4. Run Hu

In Electrical and Electronic Engineering

1. Xiaobing Luo

Citations in the corpus

• Heat and fluid flow in high-power LED packaging and applications (2016, methodology): “[202] applied the thermal spreading resistance network to optimize the LED chip arrangement for an 80 W LED lamp.”
• Light emitting diodes reliability review (2012, unknown): “tools, simulation, and prototype testing [29–36].”