LED Packaging for Lighting Applications: Design, Manufacturing and Testing

By Sheng Liu, Xiaobing Luo. 2011

346 citations recorded by the source corpus.

Subfields: Atomic and Molecular Physics, and Optics, Organic Chemistry, Polymers and Plastics

View Paper: https://www.semanticscholar.org/paper/27eaa229d5567d5b0196f6a30ec783471a6d14a0

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Polymers and Plastics

1. Xiaobing Luo
2. Sheng Liu
3. Kai Wang
4. Run Hu

Citations in the corpus

• Heat and fluid flow in high-power LED packaging and applications (2016, background): “For high-power LED chips, the key part is the “PN junction” where a quantum well or multiple quantum well (MQW) layers are sandwiched with a p-GaN layer and an n-GaN layer [1].”