The effect of thermal contact resistance on heat management in the electronic packaging

By M. Grujicic, C. Zhao, E. C. Dusel. 2005

242 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Mechanical Engineering, Mechanics of Materials

View Paper: https://www.semanticscholar.org/paper/fe8398bf5a92a66f0ec69579c772a8ec24aedc69

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Electrical and Electronic Engineering

1. Xiaobing Luo
2. D. Kong
3. Ping Ping

In Mechanical Engineering

1. Xiaobing Luo
2. Sheng Liu
3. D. Kong
4. Ping Ping
5. Guoming Chen
6. J. Wen
7. Rongqi Peng

In Mechanics of Materials

1. Xiaobing Luo
2. Sheng Liu

Citations in the corpus

• Investigation on thermal management performance of PCM-fin structure for Li-ion battery module in high-temperature environment (2018, background): “each other making the real contact area (a summation of all micro-contact areas) only a small portion of the nominal contact area [52].”
• Thermal analysis and optimization of multiple LED packaging based on a general analytical solution (2009, background): “For the multi-chip packaging design, spreading thermal resistance should be considered [5,6].”