H. Gan

Electrical and Electronic Engineering · 2005

A researcher in the Science corpus: 1 paper; trusts 1 researcher and is trusted by 0 researchers here, as inferred from the citation graph.

Subfields

Whom H. Gan trusts overall

Their strongest outbound trust, strongest first, inferred from their citations.

  1. King-Ning Tu

Papers from H. Gan's perspective

Ordered by how strongly the researchers H. Gan trusts endorse each paper. Same corpus, a different order for every researcher.

  1. Effect of Sn grain orientation on electromigration degradation mechanism in high Sn-based Pb-free solders
  2. Solder Joint Technology
  3. Effect of current crowding on void propagation at the interface between intermetallic compound and solder in flip chip solder joints
  4. Thermomigration in SnPb composite flip chip solder joints
  5. Instrumented Indentation Testing
  6. Direct Electrochemical Reduction of Titanium Dioxide to Titanium in Molten Calcium Chloride.
  7. A critical review of mechanical properties of powder metallurgy titanium
  8. COLD COMPACTION AND SINTERING OF TITANIUM AND ITS ALLOYS FOR NEAR-NET-SHAPE OR PREFORM FABRICATION
  9. The automotive application of discontinuously reinforced TiB-Ti composites
  10. Titanium powder production by preform reduction process (PRP)

Their papers