Low temperature sinter technology die attachment for power electronic applications

By C. Gobl, J. Faltenbacher. 2010 6th International Conference on Integrated Power Electronics Systems, 2010

169 citations recorded by the source corpus.

View Paper: https://www.semanticscholar.org/paper/d3c8a16fb733fd7eb40fbb53b44c459e03d822d1

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

1. Y. T. Lin

Citations in the corpus

• Identifying the Development State of Sintered Silver (Ag) as a Bonding Material in the Microelectronic Packaging Via a Patent Landscape Study (2016, methodology): “The sintered Ag joint of 20% porosity was achieved by four times reduction in sintering pressure to produce the Ag joint with 5% porosity [93].”