Solid state interfacial reaction of Sn–37Pb and Sn–3.5Ag solders with Ni–P under bump metallization

By M. He, Zhong Chen, G. Qi. 2004

202 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/a43ccdd78271d8ebef545a0344ff25b6f688b591