BGA brittle fracture - alternative solder joint integrity test methods

By K. Newman. Proceedings Electronic Components and Technology, 2005. ECTC '05., 2005

149 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/18c2bc2a3b25b597e990a3bb6e5bd2a8b66d080a