Total ionizing dose effects in MOS oxides and devices
By T. Oldham, F. B. McLean. 2003
864 citations recorded by the source corpus.
Subfields: Electrical and Electronic Engineering
View Paper: https://www.semanticscholar.org/paper/348c9aa67ffeede9d501900ee40a5d853ccf1b36
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In Electrical and Electronic Engineering
- D. Fleetwood
- Pascale Gouker
- Véronique Ferlet-Cavrois
- Alessandro Paccagnella
- Lloyd W. Massengill
- R. Lacoe
- Zheng Chen
Citations in the corpus
- Evolution of Total Ionizing Dose Effects in MOS Devices With Moore’s Law Scaling (2018, background): “The dominant radiationinduced oxide trap in SiO2 is an O vacancy defect (E’ center), and the dominant radiation-induced interface-trap is a dangling Si bond at the Si/SiO2 interface (Pb center) [3], [5], [8], [37].”
- Radiation-Induced Short Channel (RISCE) and Narrow Channel (RINCE) Effects in 65 and 130 nm MOSFETs (2015, background): “[23], which contributes to a decrease of their compensation.”
- Single Event Transients in Digital CMOS—A Review (2013, background): “Ionizing radiation is known to degrade the electrical characteristics of NMOS and PMOS transistors because of the radiation-induced charge trapped in oxide films and at oxide-silicon interfaces [80].”
- Radiation Effects in Commercial 1200 V 24 A Silicon Carbide Power MOSFETs (2012, background): “in rads, and q is the electronic charge [18], [19].”