Survey of High-Temperature Reliability of Power Electronics Packaging Components

By R. Khazaka, Laurent Mendizabal, D. Henry, R. Hanna. IEEE transactions on power electronics, 2015

309 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering

View Paper: https://www.semanticscholar.org/paper/16d2b1f1e6e9d5246ae00752f6a077a9e2b2c0fc

How researchers see this paper

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In Electrical and Electronic Engineering

1. Huai Wang
2. Frede Blaabjerg
3. Xiongfei Wang
4. Marco Liserre
5. Ke Ma
6. Friedrich Wilhelm Fuchs
7. Yun Wei Li
8. Poh Chiang Loh

Citations in the corpus

• Thermal management and packaging of wide and ultra-wide bandgap power devices: a review and perspective (2023, background): “A survey on the hightemperature reliability of these components is presented in [40].”
• Power Electronics Reliability: State of the Art and Outlook (2021, background): “Following the adoption of wide-bandgap devices in commercial applications, new packaging technologies are discussed in [8, 9].”