Wet etching of GaN, AlN, and SiC : a review
By D. Zhuang, J. Edgar. 2005
770 citations recorded by the source corpus.
Subfields: Condensed Matter Physics, Electrical and Electronic Engineering
View Paper: https://www.semanticscholar.org/paper/9dcc254cc526f97faf8057c2a92d12e51054ee94
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In Condensed Matter Physics
In Electrical and Electronic Engineering
Citations in the corpus
- Gallium Nitride as an Electromechanical Material (2014, methodology): “Besides patterning of GaN, some other applications of wet etching include surface treatment, defect decoration, polarity identification by producing characteristic pits or hillocks, and device fabrication on smooth surfaces [83].”
- Control of Threshold Voltage of AlGaN/GaN HEMTs by Fluoride-Based Plasma Treatment: From Depletion Mode to Enhancement Mode (2006, background): “However, the ICP dry etching has a low etch selectivity between materials and causes subsurface damages [21].”