Thermal conductivity of GaN films: Effects of impurities and dislocations
By J. Zou, D. Kotchetkov, Alexander A. Balandin, D. I. Florescu, F. Pollak. 2002
327 citations recorded by the source corpus.
Subfields: Atomic and Molecular Physics, and Optics, Condensed Matter Physics, Materials Chemistry
View Paper: https://www.semanticscholar.org/paper/916427ee55e72c33efdd6ef03b4493f04ba43577
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In Atomic and Molecular Physics, and Optics
In Condensed Matter Physics
In Materials Chemistry
Citations in the corpus
- High-temperature modeling of AlGaN/GaN HEMTs (2009, methodology): “Based on various studies [35,36,38–41] we give two parameter sets in Table 2, applicable for different material quality.”
- Gallium Nitride as an Electromechanical Material (2014, background): “The thermal conductivity shows an inverse relation with the doping and impurity concentration [46], [47].”
- Benchmarking of Thermal Boundary Resistance in AlGaN/GaN HEMTs on SiC Substrates: Implications of the Nucleation Layer Microstructure (2010, background): “Microstructure includes dislocations, grain boundaries, and point defects (impurity atoms and vacancies) [10], [11].”
- Thermal Boundary Resistance Between GaN and Substrate in AlGaN/GaN Electronic Devices (2007, background): “This thermal conductivity would correspond to a dislocation density well in excess of 10(13) cm−2 in GaN [15] and is significantly lower than the thermal conductivity of polycrystalline GaN (∼15 W · m−1 · K−1) [17], more similar to the one measured for AlN films sputtered on Si [3].”