Polycrystalline silicon-germanium films for integrated microsystems

By A. Franke, J. Heck, Tsu-Jae King, R. Howe. 2003

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MEMS technology for timing and frequency control (2005, methodology): “prevents the process of [14] from widespread use, other variants of this modular process have now been demonstrated that allow more conventional CMOS metals [15].”
Series-resonant VHF micromechanical resonator reference oscillators (2004, background): “0018-9200/04$20.00 © 2004 IEEE Unfortunately, a recently demonstrated 10-MHz oscillator using a variant of the above CC-beam resonator together with an off-the-shelf amplifier exhibits a phase noise of only 80 dBc/Hz at 1-kHz carrier offset, and 116 dBc/Hz at far-from-carrier offsets…”
Thermal budget limits of quarter-micrometer foundry CMOS for post-processing MEMS devices (2005, background): “for the electronics and MEMS can be interleaved [2]–[8], or the MEMS can be fabricated modularly after the electronics [9]–[20].”
MEMS technology for timing and frequency control (2005, background): “Although the use of tungsten instead of the more conventional copper and aluminum prevents the process of [10] from widespread use, other variants of this modular process have now been demonstrated that allow more conventional CMOS metals [11].”
A review of MEMS oscillators for frequency reference and timing applications (2011, unknown): “A material shown to have similar mechanical properties as poly-Si while allowing processing at sufficiently low temperatures is LPCVD or PECVD SiGe.”