Mechanisms of current collapse and gate leakage currents in AlGaN/GaN heterostructure field effect transistors
By H. Hasegawa, T. Inagaki, S. Ootomo, Tamotsu Hashizume. 2003
223 citations recorded by the source corpus.
Subfields: Condensed Matter Physics, Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials
View Paper: https://www.semanticscholar.org/paper/1c845b1d1c8edbc98b1d9538bba8c64ce6baa093
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In Condensed Matter Physics
In Electrical and Electronic Engineering
In Electronic, Optical and Magnetic Materials
Citations in the corpus
- Current Collapse and High-Electric-Field Reliability of Unpassivated GaN/AlGaN/GaN HEMTs (2006, background): “] It is worth noting that the effect 1) is consistent with the “thin surface barrier” model for the gate-leakage current in GaN HEMTs proposed in [26].”
- A Comprehensive Review of Recent Progress on GaN High Electron Mobility Transistors: Devices, Fabrication and Reliability (2018, background): “As we have mentioned above, GaN based HEMTs suffer the effect of current collapse [128], which can temporary increase the dynamic on-resistance due to the charge trapping effects.”
- Investigation of High-Electric-Field Degradation Effects in AlGaN/GaN HEMTs (2008, background): “In actual devices, both surface traps at the exposed GaN surface and volume distributions of near-surface traps [20], [25] can be”