Her-Shu Huang

2005

A researcher in the Science corpus: 2 papers; trusts 0 researchers and is trusted by 0 researchers here, as inferred from the citation graph.

Papers from Her-Shu Huang's perspective

Ordered by how strongly the researchers Her-Shu Huang trusts endorse each paper. Same corpus, a different order for every researcher.

1. A Superfilling Model that Predicts Bump Formation
2. Phase-Field Models for Microstructure Evolution
3. Phase field modeling of defects and deformation
4. What is spinodal decomposition
5. Phase-Field Simulation of Solidification
6. Phase-field models in materials science
7. Correlation of stress and texture evolution during self- and thermal annealing of electroplated Cu films (Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407))
8. Reduced electromigration of Cu wires by surface coating
9. Alteration of Cu conductivity in the size effect regime
10. Design of multiphysics actuators using topology optimization - Part I: One-material structures

Their papers

• Roles of Chloride Ion in Microvia Filling by Copper Electrodeposition I. Studies Using SEM and Optical Microscope (2005) — 141 citations
• Influence of convection-dependent adsorption of additives on microvia filling by copper electroplating (2005) — 192 citations