Y. Ohki
Materials Chemistry · 2005–2014
A researcher in the Science corpus: 7 papers; trusts 1 researcher and is trusted by 2 researchers here, as inferred from the citation graph.
Subfields
- Materials Chemistry — 37 citations into it; #5,532 of 11,513 by trust here, #4,479 by citations
- Biomedical Engineering — 21 citations into it; #5,176 of 10,734 by trust here, #3,989 by citations
- Polymers and Plastics — 15 citations into it; #1,230 of 2,623 by trust here, #1,875 by citations
Whom Y. Ohki trusts overall
Their strongest outbound trust, strongest first, inferred from their citations.
Who trusts Y. Ohki overall
Papers from Y. Ohki's perspective
Ordered by how strongly the researchers Y. Ohki trusts endorse each paper. Same corpus, a different order for every researcher.
- Interfaces are the dominant feature of dielectrics at the nanometric level (IEEE transactions on dielectrics and electrical insulation)
- Polymer nanocomposites as dielectrics and electrical insulation-perspectives for processing technologies, material characterization and future applications (IEEE transactions on dielectrics and electrical insulation)
- Dielectric nanocomposites with insulating properties (IEEE transactions on dielectrics and electrical insulation)
- Surface degradation of polyamide nanocomposites caused by partial discharges using IEC (b) electrodes (IEEE transactions on dielectrics and electrical insulation)
- Effects of nano-filler addition on partial discharge resistance and dielectric breakdown strength of Micro-Al2O3Epoxy composite (IEEE transactions on dielectrics and electrical insulation)
- Thermally conductive composite films of hexagonal boron nitride and polyimide with affinity-enhanced interfaces
- Nanocomposite Science And Technology
- Enhanced thermal conductivity of boron nitride epoxy‐matrix composite through multi‐modal particle size mixing
- DC conduction and electrical breakdown of MgO/LDPE nanocomposite (IEEE transactions on dielectrics and electrical insulation)
- Enhanced partial discharge resistance of epoxy/clay nanocomposite prepared by newly developed organic modification and solubilization methods (IEEE transactions on dielectrics and electrical insulation)
Their papers
- Role of interface on the thermal conductivity of highly filled dielectric epoxy/AlN composites (2012) — 429 citations
- Development of epoxy/BN composites with high thermal conductivity and sufficient dielectric breakdown strength partI - sample preparations and thermal conductivity (2011) — 137 citations
- Proposal of a multi-core model for polymer nanocomposite dielectrics (2005) — 1,092 citations
- Effects of nano-filler addition on partial discharge resistance and dielectric breakdown strength of Micro-Al2O3Epoxy composite (2010) — 163 citations
- Dielectric properties of XLPE/Sio2 nanocomposites based on CIGRE WG D1.24 cooperative test results (2011) — 140 citations
- Electric modulus powerful tool for analyzing dielectric behavior (2014) — 175 citations
- A plasmonic photocatalyst consisting of silver nanoparticles embedded in titanium dioxide. (2008) — 1,441 citations