Enhanced thermal conductivity of boron nitride epoxy‐matrix composite through multi‐modal particle size mixing

By Kam Chuen Yung, H. Liem. 2007

300 citations recorded by the source corpus.

Subfields: Materials Chemistry, Mechanical Engineering, Polymers and Plastics

View Paper: https://www.semanticscholar.org/paper/f303a13900a6ad3533b26d64ec7cf2b91aa2d883

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Materials Chemistry

1. Toshikatsu Tanaka
2. Y. Ohki
3. M. Kozako
4. Xiaobing Luo
5. Sheng Liu
6. Kai Wang
7. Run Hu
8. Azman Hassan

In Mechanical Engineering

1. Xiaobing Luo
2. Sheng Liu
3. Kai Wang
4. Run Hu
5. Azman Hassan
6. C. Idumah

In Polymers and Plastics

1. Toshikatsu Tanaka
2. Y. Ohki
3. C. Idumah
4. M. Kozako
5. Xiaobing Luo
6. Sheng Liu
7. Kai Wang
8. Run Hu

Citations in the corpus

• Development of epoxy/BN composites with high thermal conductivity and sufficient dielectric breakdown strength partI - sample preparations and thermal conductivity (2011, background): “Plenty of works about epoxy composites loaded with different fillers such as Al2O3 (aluminum oxide) [4, 5], SiC (silicon carbide) [6, 7], AlN (aluminum nitride) [8, 9], BaTiO3 (barium titanate) [10] and BN (boron nitride) [8, 11] were executed.”
• Recently emerging trends in thermal conductivity of polymer nanocomposites (2016, background): “2007), BN powder (Yung and Liem 2007), diamond powder (Zhang et al.”