Development of epoxy/BN composites with high thermal conductivity and sufficient dielectric breakdown strength partI - sample preparations and thermal conductivity

By Zengbin Wang, T. Iizuka, M. Kozako, Y. Ohki, Toshikatsu Tanaka. IEEE transactions on dielectrics and electrical insulation, 2011

137 citations recorded by the source corpus.

Subfields: Biomedical Engineering, Materials Chemistry, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/cae97ea087e926d925aeaa5ad2e3792b52f34acf

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Biomedical Engineering

1. Takahiro Imai
2. Toshikatsu Tanaka
3. Hongbing Lu
4. Alexander A. Balandin
5. Issouf Fofana
6. S. Singha
7. M. Thomas
8. Michael G. Danikas

In Materials Chemistry

1. Takahiro Imai
2. Xiangfan Xu
3. Johan Liu
4. J. Hansson
5. Toshikatsu Tanaka
6. Hongbing Lu
7. Alexander A. Balandin
8. Yifeng Fu

In Mechanical Engineering

1. Alexander A. Balandin

Citations in the corpus

• Graphene related materials for thermal management (2019, methodology): “The effect of the coupling agent is also verified by Wang et al who applied hBN, cubic BN (cBN) and conglomerated hBN as fillers in the composites [45].”
• Advances in nanodielectric materials over the past 50 years (2013, background): “Nanofiller addition will improve dielectric breakdown performance [36], [37].”
• Investigation of the through-plane thermal conductivity of polymer composites with in-plane oriented hexagonal boron nitride (2018, background): “Adding spherical or irregular fillers would also effectively hinder the in-plane orientation of plateletshaped fillers [49,50].”