Thermally conductive composite films of hexagonal boron nitride and polyimide with affinity-enhanced interfaces

By Kimiyasu Sato, Hitomi Horibe, T. Shirai, Y. Hotta, H. Nakano, H. Nagai, Kenshi Mitsuishi, K. Watari. 2010

354 citations recorded by the source corpus.

Subfields: Materials Chemistry, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/6fe15bda3ae7ec4a24cc41ac2c7d483b5337af43

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In Materials Chemistry

1. Toshikatsu Tanaka
2. P. Jiang
3. Xingyi Huang
4. Y. Ohki
5. M. Kozako
6. Takahiro Imai
7. Shengtao Li
8. Jinliang He

Citations in the corpus

• Investigation of the through-plane thermal conductivity of polymer composites with in-plane oriented hexagonal boron nitride (2018, background): “hBN has excellent electrical insulation comparable with PTFE, but generally there are polar groups on the edge planes of platelets such as hydroxyl groups (AOH) and amino groups (ANH2) [37].”
• A review of dielectric polymer composites with high thermal conductivity (2011, background): “In addition to high thermal conductivity, high electrical resistivity, and low dielectric constant, BN also has excellent high temperature resistance and low density, making it ideal for electronic packaging application [9].”