Effects of nano-filler addition on partial discharge resistance and dielectric breakdown strength of Micro-Al2O3Epoxy composite

By Zhe Li, K. Okamoto, Y. Ohki, Toshikatsu Tanaka. IEEE transactions on dielectrics and electrical insulation, 2010

163 citations recorded by the source corpus.

Subfields: Biomedical Engineering, Electrical and Electronic Engineering, Materials Chemistry

View Paper: https://www.semanticscholar.org/paper/497d98532456de15019b39c8ee14df25b57a3741

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Biomedical Engineering

1. Toshikatsu Tanaka
2. Y. Ohki
3. M. Kozako
4. Takahiro Imai
5. S. Singha
6. M. Thomas
7. Michael G. Danikas
8. Issouf Fofana

In Electrical and Electronic Engineering

1. Toshikatsu Tanaka

In Materials Chemistry

1. Toshikatsu Tanaka
2. Y. Ohki
3. M. Kozako
4. Takahiro Imai
5. S. Singha
6. M. Thomas
7. Michael G. Danikas
8. Shengtao Li

Citations in the corpus

• Development of epoxy/BN composites with high thermal conductivity and sufficient dielectric breakdown strength partI - sample preparations and thermal conductivity (2011, background): “However, it is also found that epoxy/micro inorganic particle composite usually has much lower breakdown (BD) strength [3].”