Hybrid Silicon Photonic Integrated Circuit Technology

By Martijn J. R. Heck, J. Bauters, M. Davenport, J. Doylend, Siddharth R. Jain, G. Kurczveil, S. Srinivasan, Yongbo Tang, John E. Bowers. IEEE Journal of Selected Topics in Quantum Electronics, 2013

398 citations recorded by the source corpus.

In this paper, we review the current status of the hybrid silicon photonic integration platform with emphasis on its prospects for increased integration complexity. The hybrid silicon platform is maturing fast as increasingly complex circuits are reported with tens of integrated components including on-chip lasers. It is shown that this platform is well positioned and holds great potential to address future needs for medium-scale photonic integrated circuits.

Subfields: Atomic and Molecular Physics, and Optics, Electrical and Electronic Engineering

View Paper: https://www.semanticscholar.org/paper/757a9618fcbb582a653ef5959abdc7e88108d82c

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In Atomic and Molecular Physics, and Optics

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Citations in the corpus

From Scaling Disparities to Integrated Parallelism: A Decathlon for a Decade (2017, background): “lithic [140]–[143], hybrid [144], [145], or by chip stacking and 3D interconnection techniques [146], [147].”
Advances in terahertz communications accelerated by photonics (2016, background): “Further to this recent progress in integration, the development of active Si photonics integrated technology 75–78 would enable potentially even better efficiency, easier integration with Si electronics technology and lower loss waveguides.”
Widely Tunable Narrow-Linewidth Monolithically Integrated External-Cavity Semiconductor Lasers (2015, background): “Si substrates has been a major area of research in recent years [1] with goals of lower cost and higher volume manufacturing.”
Advances in quantum cryptography (2019, neutral): “[299] M.”
III-V-on-Silicon Photonic Devices for Optical Communication and Sensing (2015, background): “Amplifiers can be used in receivers, boosting the signal before being detected which increases sensitivity [17], but are also used in more complex photonic circuits [18].”
Survey and Evaluation of Space Division Multiplexing: From Technologies to Optical Networks (2015, neutral): “PICs have been demonstrated using monolithic integration [100], [101] and hybrid integration [102].”
Highly integrated optical phased arrays: photonic integrated circuits for optical beam shaping and beam steering (2017, background): “[8] and expanded with some recent results.”
Efficient low-loss InGaAsP/Si hybrid MOS optical modulator (2017, methodology): “ the optical parameters of InGaAsP, its physical parameters taken from the literature were used. In the case of In 1-x Ga x As y P 1-y lattice-matched to InP, x and y have the relationship11 �=0.47�. (1) The direct band gap of InGaAsP at the Γ point is represented as12 𝐸�=1.35−0.72�+0.12�2 [eV]. (2”