Increasing the thermal conductivity of boron nitride and aluminum nitride particle epoxy-matrix composites by particle surface treatments

By Yunsheng Xu, D. Chung. 2000

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Development of epoxy/BN composites with high thermal conductivity and sufficient dielectric breakdown strength partI - sample preparations and thermal conductivity (2011, background): “Plenty of works about epoxy composites loaded with different fillers such as Al2O3 (aluminum oxide) [4, 5], SiC (silicon carbide) [6, 7], AlN (aluminum nitride) [8, 9], BaTiO3 (barium titanate) [10] and BN (boron nitride) [8, 11] were executed.”
Polymer composites for thermal management: a review (2016, methodology): “[26] So, for inorganic fillers surface treatment is an important filler pre-processing method.”
Heat and fluid flow in high-power LED packaging and applications (2016, methodology): “For the solder joints, one primary factor that hinders joint reliability is the void formation during the reflow process [119-126].”
A review of dielectric polymer composites with high thermal conductivity (2011, methodology): “In this case, the thermal conductivity of the composites is largely governed by the conductive network of the particles, and the methods that can increase the thermal conductivity of the composite include maximizing the conductive pathways, minimizing the thermal resistance within the conductive pat”