Lead-free Solders in Microelectronics
By Mulugeta Abtew, G. Selvaduray. 2000
1,865 citations recorded by the source corpus.
Subfields: Electrical and Electronic Engineering, General Materials Science
View Paper: https://www.semanticscholar.org/paper/902f42de003a78d7f7c7b0234d3c08128ca2ee26
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In Electrical and Electronic Engineering
Citations in the corpus
- Die Attach Materials for High Temperature Applications: A Review (2011, background): “The European nations issued a directive on “Waste from Electrical and Electronic Equipment” on the 1st of January 2004 [28].”
- Corrosion characterization of tin–lead and lead free solders in 3.5 wt.% NaCl solution (2008, background): “[13] provide a brief review of the corrosion properties of lead free solders in microelectronics.”