Novel three-dimensional embedded SU-8 microchannels fabricated using a low temperature full wafer adhesive bonding

By F. Blanco, M. Agirregabiria, J. García, J. Berganzo, M. Tijero, M. Arroyo, J. Ruano, I. Aramburu, K. Mayora. 2004

201 citations recorded by the source corpus.

Subfields: Biomedical Engineering, Electrical and Electronic Engineering

View Paper: https://www.semanticscholar.org/paper/640f83faef68efe46194a507a331362838fb09ce

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In Biomedical Engineering

1. John E. Bowers
2. Aaron J. Fleischman
3. A. Mata
4. Shuvo Roy
5. R. Baets
6. Brian J. Kim
7. Ellis Meng

In Electrical and Electronic Engineering

1. John E. Bowers
2. Gunther Roelkens
3. Di Liang
4. R. Baets
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7. Po Dong
8. C. Doerr

Citations in the corpus

• Ultra-thin DVS-BCB adhesive bonding of III-V wafers, dies and multiple dies to a patterned silicon-on-insulator substrate (2013, methodology): “Both thermoplastic polymers, like SU-8 [11] and thermosetting polymers, such as spin-on glass [12], polyimide and DVS-BCB (divinylsiloxane-bis-benzocyclobutene), are used as adhesives [13].”
• Fabrication of multi-layer SU-8 microstructures (2006, background): “Consequently, if the wafer is not horizontal during soft bake, there is increased likelihood of thickness non-uniformity due to SU-8 flow [5, 41].”
• Hybrid Integrated Platforms for Silicon Photonics (2010, methodology): “In [34], 20–45 μm thick SU-8 epoxy layers (thermosetting) were used to bond a 100 mm silicon wafer onto a 100 mm Pyrex wafer.”