Design and Performance Modeling for Single-Walled Carbon Nanotubes as Local, Semiglobal, and Global Interconnects in Gigascale Integrated Systems

By A. Naeemi, James D. Meindl. IEEE Transactions on Electron Devices, 2007

259 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Materials Chemistry

View Paper: https://www.semanticscholar.org/paper/625f561babb3a6274b7065321de5799ec5577f4d

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In Electrical and Electronic Engineering

In Materials Chemistry

Citations in the corpus

Circuit Modeling and Performance Analysis of Multi-Walled Carbon Nanotube Interconnects (2008, background): “From the aforementioned discussions and the results from previous SWCNT interconnect modeling works [14]–[17], it can be concluded that both SWCNT and MWCNT interconnects can achieve better performance than Cu wires for long lengths.”
On the Applicability of Single-Walled Carbon Nanotubes as VLSI Interconnects (2009, background): “In this case, RC = 0, assuming high-quality embedded contacts as done in [43].”
Compact Physics-Based Circuit Models for Graphene Nanoribbon Interconnects (2009, background): “Unlike magnetic inductance, kinetic inductance has no mutual component in it, and its value scales down linearly with the increase in the number of conduction channels (8 nH/μm/Nch) [ 23 ].”
Crosstalk Prediction of Single- and Double-Walled Carbon-Nanotube (SWCNT/DWCNT) Bundle Interconnects (2009, background): “metallic wire with the same overall cross section [7].”
Carbon Nanomaterials for Next-Generation Interconnects and Passives: Physics, Status, and Prospects (2009, methodology): “Almost all works analyzing the applicability of CNT interconnects in VLSI circuits [64], [65], [117], have only addressed their electrical performance in terms of providing low-latency horizontal paths on a chip, except some initial analysis in [102], [125] but no thermal model was provided.”
Performance Modeling for Single- and Multiwall Carbon Nanotubes as Signal and Power Interconnects in Gigascale Systems (2008, background): “It is important to note that bundles of SWNTs (D = 1n m) whose chirality is random can outperform copper wires only for cross-sectional dimensions smaller than 50 nm. This is in contrast to previous comparisons which showed such bundles could potentially offer conductivities larger than that of bulk”
High-Frequency Analysis of Carbon Nanotube Interconnects and Implications for On-Chip Inductor Design (2009, background): “It has been shown that single-walled CNT (SWCNT) interconnects can outperform Cu interconnects significantly, particularly for long lengths [6]–[8].”