High-Frequency Analysis of Carbon Nanotube Interconnects and Implications for On-Chip Inductor Design

By Hong Li, Kaustav Banerjee. IEEE Transactions on Electron Devices, 2009

165 citations recorded by the source corpus.

Subfields: Biomedical Engineering, Electrical and Electronic Engineering, Materials Chemistry

View Paper: https://www.semanticscholar.org/paper/0ebfbb1d291780fa86d5e7da1fd033c02f3e45ee

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Biomedical Engineering

1. Chuan Xu
2. Hong Li
3. Kaustav Banerjee
4. Roberto Suaya
5. Navin Srivastava

In Electrical and Electronic Engineering

1. Hong Li
2. Chuan Xu
3. Kaustav Banerjee
4. Navin Srivastava
5. Roberto Suaya

In Materials Chemistry

1. Hong Li
2. Kaustav Banerjee
3. Chuan Xu
4. Navin Srivastava
5. Roberto Suaya

Citations in the corpus

• Compact AC Modeling and Performance Analysis of Through-Silicon Vias in 3-D ICs (2010, methodology): “Their low electrical resistivity [19], [20], reduced skin effect [21], [22], high thermal conductivity [23], and current carry capacity [19] merit additional attention.”
• Carbon Nanomaterials for Next-Generation Interconnects and Passives: Physics, Status, and Prospects (2009, background): “The high-frequency resistance of this semiinfinite structure can be calculated (detailed equations can be found in [119]) and its ratio with respect to dc resistance is shown in Fig.”